at >55 dB per connector. These same quality performance
benchmarks are also being used for the upcoming 192-f
connector undergoing IEC compliance testing.
• Extreme capacity with fiber strand counts
of up to144-fibers
• Supports 32-f to 144-f strands; 192-f in development
• Available in 32-f, 48-f, 64-f, 96-f, 144-f strand
configurations ready for production
• Small form factor, high density
• Highest performance and lowest dB loss
(96-f per IEC 61300-3-34, IEC 61753-1)
• Quick polarity flips and gender changes
• Self-cleaning to eliminate dust and debris
• Self-protecting shield shroud
• Grouped for QSFP; for example, the 32-f version,
having 4 discrete ferrules on it with each having
8 strands, would have 4 QSFP connectors built into it
• Easy reach and push-twist connect operation
• The hyper-capacity connector and its various
configurations are currently being manufactured
by a well-known ICT manufacturer most reputable
for its stringent quality assurance and quality
control processes
One of the major achievements in the design of the
hyper-capacity connector is that it fits so many needed
FIGURE 18: Shown is the hyper-capacity connector. The only
closely comparable connector for IEC testing is a high quality
high-capacity MPO 24-f connector with an average insertion
loss performance of <0.50 dB. The 96-f version was stringently
third-party and IEC tested against the MPO 24-f and
consistently produced the <0.35 dB insertion loss.
48 I ICT TODAY
FIGURE 19: Shown is the patch panel that would convert,
for example, a hyper-capacity 96-f connector (rear) to 48
LC connectors (front). This configuration was tested per IEC
61300-3-34 and IEC 61753-1 and resulted in low insertion
losses (≤0.35 dB for the 96-f connector and ≤0.25 dB for
the LCs) for >97% of random mating samples for SMF. The
return loss for the hyper-capacity and LCs were >55 dB.
features with high-capacity 144-fibers (and soon 192-
fibers) while producing consistently low <0.35 dB insertion
loss and >55 dB return loss for ITU-T G.657.A1 and
G652.D compliant SMF (Figure 18).
The hyper-capacity connector product line also
includes patented technologies that help adapt the connector
to existing device and infrastructure technologies
including LC, MPO/MTP, and QSFP. Its patch panel can
convert the hyper-capacity, self-cleaning and protecting
universal multi-fiber connector to any current or future
connector technology, while providing the freedom
and flexibility to meet specific physical infrastructure
requirements. For example, the patch panels can convert
the hyper-capacity connector (any number of
strands) to LC and MPO/MT at the infrastructure port
and to QSFP connector(s) at the transceiver, as well
as many other applications (Figure 19).